RGB-Stack Light Emitting Diode Modules with Transparent Glass Circuit Board and Oil Encapsulation
Autor: | Shang-Ping Ying, Si-Yun Jian, Cher Ming Tan, Ying-Chang Li, Yuan-Hsiao Chang, Der-Hwa Yeh, Chao-Sung Lai, Liann-Be Chang, Lee Chow, Yu-Chi Li, Preetpal Singh, Ting-Yu Chao |
---|---|
Jazyk: | angličtina |
Rok vydání: | 2018 |
Předmět: |
Materials science
cooling oil encapsulation Stacking 02 engineering and technology 01 natural sciences FCLED lcsh:Technology Article law.invention Printed circuit board Thermal conductivity law 0103 physical sciences stacking module transparent glass circuit board General Materials Science lcsh:Microscopy Diode lcsh:QC120-168.85 010302 applied physics lcsh:QH201-278.5 business.industry lcsh:T 021001 nanoscience & nanotechnology Stack light lcsh:TA1-2040 Color mixing Optoelectronics RGB color model lcsh:Descriptive and experimental mechanics lcsh:Electrical engineering. Electronics. Nuclear engineering 0210 nano-technology business lcsh:Engineering (General). Civil engineering (General) lcsh:TK1-9971 Light-emitting diode |
Zdroj: | Materials, Vol 11, Iss 3, p 365 (2018) Materials; Volume 11; Issue 3; Pages: 365 Materials |
ISSN: | 1996-1944 |
Popis: | The light emitting diode (LED) is widely used in modern solid-state lighting applications, and its output efficiency is closely related to the submounts’ material properties. Most submounts used today, such as low-power printed circuit boards (PCBs) or high-power metal core printed circuit boards (MCPCBs), are not transparent and seriously decrease the output light extraction. To meet the requirements of high light output and better color mixing, a three-dimensional (3-D) stacked flip-chip (FC) LED module is proposed and demonstrated. To realize light penetration and mixing, the mentioned 3-D vertically stacking RGB LEDs use transparent glass as FC package submounts called glass circuit boards (GCB). Light emitted from each GCB stacked LEDs passes through each other and thus exhibits good output efficiency and homogeneous light-mixing characteristics. In this work, the parasitic problem of heat accumulation, which caused by the poor thermal conductivity of GCB and leads to a serious decrease in output efficiency, is solved by a proposed transparent cooling oil encapsulation (OCP) method. |
Databáze: | OpenAIRE |
Externí odkaz: | |
Nepřihlášeným uživatelům se plný text nezobrazuje | K zobrazení výsledku je třeba se přihlásit. |