A study of compact thermal model topologies in CFD for a flip chip plastic ball grid array package
| Autor: | V. Adams, Tien-Yu Tom Lee, S. Shidore |
|---|---|
| Rok vydání: | 2001 |
| Předmět: |
Natural convection
business.industry Computer science Thermal resistance Mechanical engineering Computational fluid dynamics Heat sink Electronic Optical and Magnetic Materials Forced convection Ball grid array Thermal Electronic engineering Boundary value problem Electrical and Electronic Engineering business Flip chip |
| Zdroj: | IEEE Transactions on Components and Packaging Technologies. 24:191-198 |
| ISSN: | 1521-3331 |
| Popis: | A previously validated detailed model of a 119-pin Flip-Chip Plastic Ball Grid Array (FC-PBGA) package was created and validated against experimental data for natural convection and forced convection environments. Next, two compact models were derived, a two-resistor model (created using the JEDEC-standard based computational approach), and a multi-resistor model (created using the DELPHI optimization approach that was boundary condition independent within engineering accuracy). The compact models were placed in natural convection and forced convection (velocities of 1 and 2 m/s) environments with and without a heatsink. Based on the agreement obtained between the detailed model and compact model simulations, the accuracy and validity of the two compact models was assessed. Of the two compact thermal models considered, the Delphi multi-resistor model provided the same predictive estimates (within 5%) as simulations involving a detailed thermal model of the package in natural and forced convection environments both with and without attached heatsinks. Some thermal modeling issues were addressed with respect to implementation of compact thermal models with attached heatsinks. |
| Databáze: | OpenAIRE |
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