Oxygen isotopic exchange occurring during dry thermal oxidation of 6H SiC

Autor: Edit Szilágyi, Gábor Battistig, Ian Vickridge, Isabelle Trimaille, J.-J. Ganem, D. Tromson
Přispěvatelé: Groupe de Physique des Solides (GPS), Université Pierre et Marie Curie - Paris 6 (UPMC)-Université Paris Diderot - Paris 7 (UPD7)-Centre National de la Recherche Scientifique (CNRS)
Rok vydání: 2002
Předmět:
Zdroj: Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, Elsevier, 2002, 190, pp.574. ⟨10.1016/S0168-583X(01)01303-9⟩
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, 2002, 190, pp.574. ⟨10.1016/S0168-583X(01)01303-9⟩
ISSN: 0168-583X
Popis: SiC is a large band gap semiconductor, promising for high power and high frequency devices. The thermal oxide is SiO2 however the growth rates of thermal oxide on SiC are substantially slower than on Si, and different along the polar directions ( 〈0 0 0 1 〉 and 〈0 0 0 1〉 in the hexagonal polytypes). Thorough understanding of the oxide growth mechanisms may give us new insights into the nature of the SiO2/SiC interface, crucial for device applications. We have determined growth kinetics for ultra-dry thermal oxidation of 6H SiC at 1100 °C for pressures from 3 to 200 mbar. At 3 mbar, the lowest pressure studied, the oxide growth rates along the two polar directions are virtually the same. At higher pressures growth is faster on the carbon-terminated (0 0 0 1 ) face. After consecutive oxidations at 1100 °C and 100 mbar in 18 O2 and 16 O2 gases, 18 O depth profiles show significant isotopic exchange and oxygen movement within the oxide during oxidation.
Databáze: OpenAIRE