Mechanistic Studies on the Insertion of Carbonyl Substrates into Cu‐H: Different Rate‐Limiting Steps as a Function of Electrophilicity
Autor: | R. Morris Bullock, Amy L. Speelman, Benjamin D. Neisen, Ba L. Tran, Thilina Gunasekara, Eric S. Wiedner |
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Rok vydání: | 2020 |
Předmět: | |
Zdroj: | Angewandte Chemie International Edition. 59:8645-8653 |
ISSN: | 1521-3773 1433-7851 |
DOI: | 10.1002/anie.201916406 |
Popis: | We report mechanistic studies on the insertion reactions of [(NHC)Cu(μ-H)]2 complexes with carbonyl substrates by UV-vis and 1 H NMR spectroscopic kinetic studies, H/D isotopic labelling, and X-ray crystallography. The results of these comprehensive studies show that the insertion of Cu-H with an aldehyde, ketone, activated ester/amide, and unactivated amide consist of two different rate limiting steps: the formation of Cu-H monomer from Cu-H dimer for more electrophilic substrates, and hydride transfer from a transient Cu-H monomer for less electrophilic substrates. We also report spectroscopic and crystallographic characterization of rare Cu-hemiacetalate and Cu-hemiaminalate moieties from the insertion of an ester or amide into the Cu-H bond. |
Databáze: | OpenAIRE |
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