Defect-Oriented Non-Intrusive RF Test Using On-Chip Temperature Sensors
| Autor: | Haralampos-G. Stratigopoulos, Josep Altet, Salvador Mir, Louay Abdallah |
|---|---|
| Přispěvatelé: | Techniques de l'Informatique et de la Microélectronique pour l'Architecture des systèmes intégrés (TIMA), Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Centre National de la Recherche Scientifique (CNRS), Electronic Engineering Department, Universitat Politècnica de Catalunya [Barcelona] (UPC), Techniques of Informatics and Microelectronics for integrated systems Architecture (TIMA), Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP)-Centre National de la Recherche Scientifique (CNRS)-Université Grenoble Alpes (UGA), Universitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica, Universitat Politècnica de Catalunya. HIPICS - Grup de Circuits i Sistemes Integrats d'Altes Prestacions |
| Jazyk: | angličtina |
| Rok vydání: | 2013 |
| Předmět: |
Engineering
Radiofrequency amplifiers integrated-circuit-testing Y-factor 02 engineering and technology Substrate (electronics) Hardware_PERFORMANCEANDRELIABILITY Integrated circuit testing Circuits integrats -- Verificació Enginyeria electrònica::Instrumentació i mesura::Sensors i actuadors [Àrees temàtiques de la UPC] 0202 electrical engineering electronic engineering information engineering Hardware_INTEGRATEDCIRCUITS Temperature sensors [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics Electronic circuit Termometria -- Aparells i instruments business.industry low-noise-amplifiers 020208 electrical & electronic engineering Integrated circuits -- Verification Low noise amplifiers Electrical engineering Enginyeria electrònica::Microelectrònica::Circuits integrats [Àrees temàtiques de la UPC] Dissipation Low-noise amplifier Temperature measuring instruments 020202 computer hardware & architecture temperature-sensors PACS 85.42 Thermal monitoring business Circuit under test |
| Zdroj: | IEEE VLSI Test Symposium (VTS'13) IEEE VLSI Test Symposium (VTS'13), USA, April 29-May 02 IEEE VLSI Test Symposium (VTS'13), USA, April 29-May 02, Apr 2013, Berkeley, CA, United States. pp.1-6, ⟨10.1109/VTS.2013.6548889⟩ UPCommons. Portal del coneixement obert de la UPC Universitat Politècnica de Catalunya (UPC) Recercat. Dipósit de la Recerca de Catalunya Universitat Jaume I VTS |
| Popis: | We present a built-in, defect-oriented test approach for RF circuits that is based on thermal monitoring. A defect will change the power dissipation of the circuit under test from its expected range of values which, in turn, will induce a change in the expected temperature in the substrate near the circuit. Thus, an on-chip temperature sensor that monitors the temperature near the circuit can reveal the existence of the defect. This test approach has the key advantage of being non-intrusive and transparent to the design since the temperature sensor is not electrically connected to the circuit. We discuss the basics of thermal monitoring, the design of the temperature sensor, as well as the test scheme. The technique is demonstrated on fabricated chips where a temperature sensor is employed to monitor an RF low noise amplifier. |
| Databáze: | OpenAIRE |
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