Electronic Components (EC) Reuse and Recycling – A New Approach towards WEEE Management
| Autor: | Biswajit Debnath, Priyankar Roychowdhury, Rayan Kundu |
|---|---|
| Rok vydání: | 2016 |
| Předmět: |
Engineering
business.product_category Waste management business.industry 02 engineering and technology Integrated circuit 010501 environmental sciences Reuse 021001 nanoscience & nanotechnology 01 natural sciences law.invention Microcontroller Printed circuit board law Laptop visual_art Electronic component visual_art.visual_art_medium General Earth and Planetary Sciences Electronics 0210 nano-technology business 0105 earth and related environmental sciences General Environmental Science Reusability |
| Zdroj: | Procedia Environmental Sciences. 35:656-668 |
| ISSN: | 1878-0296 |
| DOI: | 10.1016/j.proenv.2016.07.060 |
| Popis: | Waste Electrical and Electronic Equipments (WEEE) is the fastest growing waste stream in the world. In 2014, a total amount of 41.8 metric kilotonnes of WEEE was generated globally. There are two main parts of a WEEE – a) The Printed Circuit Board (PCB) and b) The Casing i.e. the polymer and/or metal portion that covers the PCB. PCBs contain a lot of components like resistors, transistors, microcontrollers, integrated circuits etc. Once a Electrical and Electronic Equipment (EEE) becomes obsolete; Electronic Components (EC) in the PCB remains unaltered. These ECs can be reused based on their status. In most of the cases, the PCBs end up in the informal sector that employs open burning, acid leaching etc to recover valuable metals from it and the residues end up in landfill which is a malpractice. In this work, two case has been considered – a) Small WEEE (mouse, speakers, headphones, mobile, radio, wires etc) and b) Large WEEE (Laptop, desktops, TV, printer etc). PCBs from these two types of WEEE have been examined. A solution is proposed that will help to enhance the reuse and recycling of the ECs obtained from the PCBs. The proper technique for de-soldering of ECs from the PCB and further testing methods has been discussed. Proper recycling routes of the unusable ECs have also been suggested. Finally, a novel framework has been proposed that will enhance the EC reusability and recycling. The findings will help the stakeholders in decision making, the researchers in considering future research direction and overall a sustainable future for both semiconductor and electronics industry. |
| Databáze: | OpenAIRE |
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