Cavity-BOX SOI: Advanced Silicon Substrate with Pre-Patterned BOX for Monolithic MEMS Fabrication
| Autor: | Jian Li, Katja Parkkinen, Marta Kluba, Ronald Dekker, Marcus Louwerse, Jaap Snijder |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 2021 |
| Předmět: |
Fabrication
Materials science lcsh:Mechanical engineering and machinery cavity-SOI cavity-BOX Silicon on insulator DBS Substrate (electronics) Article Cavity‐BOX miniaturization Etching (microfabrication) Cavity‐SOI lcsh:TJ1-1570 Wafer Electrical and Electronic Engineering Microelectromechanical systems buried hard-etch mask business.industry Mechanical Engineering foldable devices MEMS flex to rigid (F2R) Control and Systems Engineering SOI substrate patterned BOX Optoelectronics Buried hard‐etch mask business Layer (electronics) Microfabrication |
| Zdroj: | Micromachines Volume 12 Issue 4 Micromachines, Vol 12, Iss 414, p 414 (2021) Micromachines, 12(4) |
| ISSN: | 2072-666X |
| Popis: | Several Silicon on Insulator (SOI) wafer manufacturers are now offering products with customer-defined cavities etched in the handle wafer, which significantly simplifies the fabrication of MEMS devices such as pressure sensors. This paper presents a novel cavity buried oxide (BOX) SOI substrate (cavity-BOX) that contains a patterned BOX layer. The patterned BOX can form a buried microchannels network, or serve as a stop layer and a buried hard-etch mask, to accurately pattern the device layer while etching it from the backside of the wafer using the cleanroom microfabrication compatible tools and methods. The use of the cavity-BOX as a buried hard-etch mask is demonstrated by applying it for the fabrication of a deep brain stimulation (DBS) demonstrator. The demonstrator consists of a large flexible area and precisely defined 80 µm-thick silicon islands wrapped into a 1.4 mm diameter cylinder. With cavity-BOX, the process of thinning and separating the silicon islands was largely simplified and became more robust. This test case illustrates how cavity-BOX wafers can advance the fabrication of various MEMS devices, especially those with complex geometry and added functionality, by enabling more design freedom and easing the optimization of the fabrication process. |
| Databáze: | OpenAIRE |
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