Large area nanoimprint by substrate conformal imprint lithography (SCIL)
| Autor: | Marc A. Verschuuren, Mischa Megens, Albert Polman, Yongfeng Ni, Hans Van Sprang |
|---|---|
| Rok vydání: | 2017 |
| Předmět: |
010302 applied physics
Materials science Nanotechnology Conformal map 02 engineering and technology Substrate (printing) 021001 nanoscience & nanotechnology 01 natural sciences Atomic and Molecular Physics and Optics High volume manufacturing Electronic Optical and Magnetic Materials 0103 physical sciences 0210 nano-technology Instrumentation Lithography |
| Zdroj: | Advanced Optical Technologies. 6:243-264 |
| ISSN: | 2192-8584 2192-8576 |
| DOI: | 10.1515/aot-2017-0022 |
| Popis: | Releasing the potential of advanced material properties by controlled structuring materials on sub-100-nm length scales for applications such as integrated circuits, nano-photonics, (bio-)sensors, lasers, optical security, etc. requires new technology to fabricate nano-patterns on large areas (from cm2 to 200 mm up to display sizes) in a cost-effective manner. Conventional high-end optical lithography such as stepper/scanners is highly capital intensive and not flexible towards substrate types. Nanoimprint has had the potential for over 20 years to bring a cost-effective, flexible method for large area nano-patterning. Over the last 3–4 years, nanoimprint has made great progress towards volume production. The main accelerator has been the switch from rigid- to wafer-scale soft stamps and tool improvements for step and repeat patterning. In this paper, we discuss substrate conformal imprint lithography (SCIL), which combines nanometer resolution, low patterns distortion, and overlay alignment, traditionally reserved for rigid stamps, with the flexibility and robustness of soft stamps. This was made possible by a combination of a new soft stamp material, an inorganic resist, combined with an innovative imprint method. Finally, a volume production solution will be presented, which can pattern up to 60 wafers per hour. |
| Databáze: | OpenAIRE |
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