In-body wireline interfacing platform for multi-module implantable microsystems
| Autor: | Dorian Haci, Yan Liu, Sara S. Ghoreishizadeh, Timothy G. Constandinou, Andrea Mifsud |
|---|---|
| Přispěvatelé: | Wellcome Trust |
| Rok vydání: | 2019 |
| Předmět: |
Technology
Network architecture Science & Technology Computer Science Information Systems Computer science business.industry Wireline 020208 electrical & electronic engineering Engineering Electrical & Electronic 020206 networking & telecommunications 02 engineering and technology Data link Engineering Interfacing Microsystem Computer Science Telecommunications link 0202 electrical engineering electronic engineering information engineering Maximum power transfer theorem business Communications protocol Engineering Biomedical Computer hardware |
| Zdroj: | BioCAS IEEE Biomedical Circuits and Systems (BioCAS) Conference |
| DOI: | 10.1109/biocas.2019.8918756 |
| Popis: | The recent evolution of implantable medical devices from single-unit stimulators to modern implantable microsystems, has driven the need for distributed technologies, in which both the implant system and functions are partitioned across multiple active devices. This multi-module approach is made possible thanks to novel network architectures, allowing for in-body power and data communications to be performed using implantable leads. This paper discusses the challenges in implementing such interfacing system and presents a platform based on one central implant (CI) and multiple peripheral implants (PIs) using a custom 4WiCS communication protocol. This is implemented in PCB technology and tested to demonstrate intrabody communication capabilities and power transfer within the network. Measured results show CI-to-PI power delivery achieves 70 % efficiency in expected load condition, while establishing full-duplex data link with up to 4 PIs simultaneously. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|