Lifetime prediction modeling of non-insulated TO-220AB packages with lead-based solder joints during power cycling
| Autor: | Nathalie Batut, Ambroise Schellmanns, René Leroy, Sébastien Jacques, Adelphe Caldeira, Laurent Gonthier |
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| Přispěvatelé: | GREMAN (matériaux, microélectronique, acoustique et nanotechnologies) ( GREMAN - UMR 7347 ), Université de Tours-Institut National des Sciences Appliquées - Centre Val de Loire ( INSA CVL ), Institut National des Sciences Appliquées ( INSA ) -Institut National des Sciences Appliquées ( INSA ) -Centre National de la Recherche Scientifique ( CNRS ), Université François Rabelais, Polytech'Tours, Laboratoire de Mécanique et Rhéologie, Centre National de la Recherche Scientifique ( CNRS ), GREMAN (matériaux, microélectronique, acoustique et nanotechnologies) (GREMAN - UMR 7347), Université de Tours-Institut National des Sciences Appliquées - Centre Val de Loire (INSA CVL), Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Centre National de la Recherche Scientifique (CNRS), Laboratoire de Mécanique et de Rhéologie (LMR), Institut National des Sciences Appliquées - Centre Val de Loire (INSA CVL), Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Université de Tours-Polytech'Tours, Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Université de Tours (UT)-Centre National de la Recherche Scientifique (CNRS), Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Université de Tours (UT)-Polytech'Tours |
| Rok vydání: | 2012 |
| Předmět: |
010302 applied physics
Shearing (physics) Materials science Acceleration factor business.industry 020208 electrical & electronic engineering TRIAC 02 engineering and technology Structural engineering Swing Condensed Matter Physics 01 natural sciences Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Soldering 0103 physical sciences 0202 electrical engineering electronic engineering information engineering Power cycling [ SPI.NANO ] Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics Electrical and Electronic Engineering Safety Risk Reliability and Quality business ComputingMilieux_MISCELLANEOUS |
| Zdroj: | Microelectronics Reliability Microelectronics Reliability, Elsevier, 2012, 52 (1), pp.212-216. 〈10.1016/j.microrel.2011.08.017〉 Microelectronics Reliability, Elsevier, 2012, 52 (1), pp.212-216. ⟨10.1016/j.microrel.2011.08.017⟩ |
| ISSN: | 0026-2714 |
| DOI: | 10.1016/j.microrel.2011.08.017 |
| Popis: | In this paper, a physical model is proposed to estimate the TRIAC solder joint fatigue during power cycling. The lifetime prediction is based on the following assumptions: the case temperature swing (DTcase) is the main acceleration factor, the solder joints are the weakest materials in the non-insulated TO-220AB TRIAC package and the plastic strain within the solder layer due to shearing is the failure cause. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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