Estimation of maximum temperature and thermal crosstalk between two active elements in a PIC: development of a thermal equivalent circuit
| Autor: | Joana C. Mendes, Stanislav I. Maslovski, Luis Nero Alves, Hugo Neto, Shusmitha Kyatam |
|---|---|
| Rok vydání: | 2020 |
| Předmět: |
Silicon
Computer science chemistry.chemical_element Hardware_PERFORMANCEANDRELIABILITY Thermal management of electronic devices and systems engineering.material 01 natural sciences 010309 optics Crosstalk Optics Operating temperature 0103 physical sciences Thermal Hardware_INTEGRATEDCIRCUITS Electronic engineering Miniaturization Electrical and Electronic Engineering Engineering (miscellaneous) business.industry Photonic integrated circuit Diamond Epoxy Atomic and Molecular Physics and Optics chemistry visual_art engineering visual_art.visual_art_medium Equivalent circuit Photonics business |
| Zdroj: | Repositório Científico de Acesso Aberto de Portugal Repositório Científico de Acesso Aberto de Portugal (RCAAP) instacron:RCAAP |
| ISSN: | 1539-4522 |
| Popis: | The operating temperature plays a key role in the performance and lifetime of photonic integrated circuits (PICs). Miniaturization and increasing heat dissipation promote thermal crosstalk effects and pose additional challenges to the PIC designer. The European Photonics Industry Consortium recommends thermal modeling during design phase. However, a fully numerical optimization of a particular layout requires an unrealistically large number of simulations. Here, we propose a compromise approach: a set of carefully chosen simulations are performed with a multi-physics software. The obtained results are used to derive a linearized equivalent thermal circuit that can be used to maximize the power levels and to minimize the distance between the chosen components while guaranteeing the absence of a thermal crosstalk. For simplification, this model is derived considering a PIC with only two active components. Other parameters are varied, such as the material of the holder (silicon or diamond) and the layer of epoxy that is used to attach the PIC to the holder. The obtained circuit is used to determine the maximum dissipated power or the minimum distance between the components while keeping some predetermined specifications. The model can be extended to contain more elements or to include transient analysis of the temperature distribution. |
| Databáze: | OpenAIRE |
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