Achievements and Advances at CMP
| Autor: | Benoit Charlot, K. Torki, H. Delori, J.-F. Paillotin, B. Courtois, S. Eyraud |
|---|---|
| Přispěvatelé: | Techniques of Informatics and Microelectronics for integrated systems Architecture (TIMA), Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP)-Centre National de la Recherche Scientifique (CNRS)-Université Grenoble Alpes (UGA), Torella, Lucie, Techniques de l'Informatique et de la Microélectronique pour l'Architecture des systèmes intégrés (TIMA), Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Centre National de la Recherche Scientifique (CNRS) |
| Rok vydání: | 2000 |
| Předmět: |
Engineering
[SPI.NANO] Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics Heterojunction bipolar transistor Silicon on insulator Hardware_PERFORMANCEANDRELIABILITY 02 engineering and technology Integrated circuit High-electron-mobility transistor BiCMOS computer.software_genre law.invention law Hardware_INTEGRATEDCIRCUITS 0202 electrical engineering electronic engineering information engineering Electronic engineering Computer Aided Design [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics Microelectromechanical systems business.industry Electrical engineering 021001 nanoscience & nanotechnology 020202 computer hardware & architecture PACS 8542 CMOS 0210 nano-technology business computer |
| Zdroj: | Microelectronics Education ISBN: 9789048155187 3rd European Workshop on Microelectonics Education (EWME'2000) 3rd European Workshop on Microelectonics Education (EWME'2000), May 2000, Aix-en-Provence, France |
| Popis: | International audience; CMP aims at providing Universities, Research Laboratories and Industries with the facility to have their integrated circuits projects fabricated for prototyping and low volume production. Presently, users are provided with a number of processes : CMOS down to 1.8µ, BiCMOS, SiGE HBT, GaAS HEMT and SOI/SOS. Micro Electro Mechanical Systems (MEMS) are provided in standard CMP runs in CMOS, BiCMOS and HEMT GaAS, using compatible front-side bulk micro-machining. MUMPS process is offered as a surface micro-machining, MCM processes, CAD software and design kits are also provided. This paper reviews the portfolio, addresses 2 main areas of development, namely deep submicron processes and MEMS, and discusses cooperation schemes. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|