Thermal resistance investigations on new leadframe-based LED packages and boards
| Autor: | B. Pardo, Miquel Vellvehi, T. Van Weelden, A. Fargeix, P. Bancken, X. Jorda, Xavier Perpiñà, R.J. Werkhoven, Adrien Gasse, Jiri Jakovenko |
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| Jazyk: | angličtina |
| Rok vydání: | 2013 |
| Předmět: |
Engineering
Thermal resistance Mechanical engineering Thermal management of electronic devices and systems law.invention Software law Thermal Electronic engineering MIP - Materials for Integrated Products Electrical and Electronic Engineering Safety Risk Reliability and Quality Thermal analysis Materials TS - Technical Sciences Industrial Innovation business.industry Mechatronics Mechanics & Materials Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Solid-state lighting Transient (oscillation) business Light-emitting diode |
| Zdroj: | Microelectronics Reliability, 8, 53, 1084-1094 |
| Popis: | In Solid State Lighting, thermal management is a key issue. Within the CSSL consortium, we have developed an advanced leadframe based LED package to reduce the thermal resistance of the component. Numerical simulations have been implemented using Ansys® software and thermal measurements have been carried out using the forward voltage method to derive the thermal resistance. The T3ster® transient thermal analysis has been used to determine the different thermal resistance contributions in the package and in the board, showing good correlation between experimental and simulation results. As a result, low thermal resistances of 5.5 K/W have been obtained on our advanced leadframe based LED package and have been compared with the standard configuration of multiple Rebel LEDs on FR4 board. |
| Databáze: | OpenAIRE |
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