Temporary wafer bonding and debonding by an electrochemically active polymer adhesive for 3D integration
| Autor: | Göran Stemme, Niclas Roxhed, Frank Niklaus, Hithesh K. Gatty |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 2013 |
| Předmět: |
010302 applied physics
Nanoteknik Materials science genetic structures Adhesive bonding Wafer bonding ComputingMethodologies_IMAGEPROCESSINGANDCOMPUTERVISION ComputerApplications_COMPUTERSINOTHERSYSTEMS Hardware_PERFORMANCEANDRELIABILITY 02 engineering and technology Thermocompression bonding 021001 nanoscience & nanotechnology 01 natural sciences Wafer backgrinding Die preparation ComputingMethodologies_PATTERNRECOGNITION Anodic bonding 0103 physical sciences Hardware_INTEGRATEDCIRCUITS Nano Technology Wafer dicing Wafer Composite material 0210 nano-technology |
| Zdroj: | IEEE International Conference on Micro Electro Mechanical Systems (MEMS), pp. 381-384, 2013. |
| DOI: | 10.1109/MEMSYS.2013.6474258 |
| Popis: | Thin wafer handling is an important issue in 3D integration technologies. This paper reports on an efficient method for bonding a thin wafer and debonding it at room temperature from a carrier wafer. This method addresses the major problem of fragility and flexibility in handling of thin wafers used in TSV fabrication. In the presented method the carrier wafer is spin coated with an electrochemically active polymer adhesive. It is then bonded to a device wafer. The wafer stack is thinned and finally released from the carrier wafer by applying a voltage. QC 20130107 |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|