A 3D Photonic-Electronic Integrated Transponder Aggregator With $48\times 16$ Heater Control Cells

Autor: Laetitia Adelmini, Michael Hofbauer, Jong Moo Lee, Olivier Lemonnier, Claudio J. Oton, Stefano Tondini, Philippe Velha, Paolo Pintus, Francesco Testa, Gabriel Pares, Giovai Battista Preve, Jose Angel Ayucar, C. L. Manganelli, Astghik Chalyan, Stefano Stracca, Horst Zimmermann, Bernhard Goll, Nikola Zecevic, Lorenzo Pavesi, Alberto Bianchi, Christophe Kopp, Aina Serrano, Guido Chiaretti, Min-su Kim, Giorgio Fontana
Přispěvatelé: Applied Physics and Photonics, Faculty of Engineering
Rok vydání: 2018
Předmět:
Zdroj: IEEE Photonics Technology Letters. 30:681-684
ISSN: 1941-0174
1041-1135
Popis: An electronic integrated circuit (EIC) and a silicon photonic integrated circuit (PIC) are 3D-integrated. The EIC using the complementary metal–oxide–semiconductor (CMOS) part of STMicroelectronics’ BCD8sp $0.16~\mu \text{m}$ technology controls all 768 switches in the PIC individually and monitors them with 84 transimpedance amplifiers. A scalable analog–digital approach with a cell size of $100\times 100\,\,\mu \text {m}^{2}$ for thermal control of optical ring resonator switch matrices is introduced. An electrical power consumption of 220 mW for all electronic control circuits of the optical switch matrix is resulting in 5.5% of the power needed by a constant-voltage control approach.
Databáze: OpenAIRE