Microstructure Development of Mechanical-Deformation-Induced Sn Whiskers
| Autor: | Sinn-wen Chen, Katsuaki Suganuma, Yuhi Yorikado, Masanobu Tsujimoto, Junxiang Jiang, Shih Kang Lin, Keun-Soo Kim, Isamu Yanada |
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| Rok vydání: | 2007 |
| Předmět: |
Materials science
Whiskers Metallurgy chemistry.chemical_element Recrystallization (metallurgy) Condensed Matter Physics Microstructure Focused ion beam Electronic Optical and Magnetic Materials chemistry Whisker Materials Chemistry Stress relaxation Grain boundary Electrical and Electronic Engineering Tin |
| Zdroj: | Journal of Electronic Materials. 36:1732-1734 |
| ISSN: | 1543-186X 0361-5235 |
| DOI: | 10.1007/s11664-007-0284-4 |
| Popis: | The development of the microstructure of mechanical-deformation-induced Sn whiskers on electroplated films has been examined using a focused ion beam system (FIB). The 6-μm-thick matte Sn films were compressed by using a ZrO2 ball indenter under ambient conditions. After compression, tin whiskers and small nodules were found adjacent to, and several grains further away from, the indents. The cross-sectional microstructures of the indents and whiskers indicate that the lateral boundaries of the newly created grains caused by recrystallization are the main routes for stress relaxation. |
| Databáze: | OpenAIRE |
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