Fiber array-to-photonic-chip fixation and fine tuning using laser support adjustment
| Autor: | GD Giok-Djan Khoe, Huig de Waardt, J.H.C. van Zantvoort |
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| Přispěvatelé: | Electro-Optical Communication, Optical cross-connects |
| Jazyk: | angličtina |
| Rok vydání: | 2002 |
| Předmět: |
Coupling
Materials science business.industry Computer Science::Software Engineering Laser beam welding Atmospheric temperature range Deformation (meteorology) Laser Chip Atomic and Molecular Physics and Optics law.invention Optics law Optoelectronics Integrated circuit packaging Electrical and Electronic Engineering Photonics business |
| Zdroj: | IEEE Journal of Selected Topics in Quantum Electronics, 8(6), 1331-1340. Institute of Electrical and Electronics Engineers |
| ISSN: | 1077-260X |
| DOI: | 10.1109/jstqe.2002.806688 |
| Popis: | A concept for coupling lensed fiber arrays to photonic optical chips in the submicrometer range by using metal deformation is presented. Fine-tuning is possible despite already secured positions between the parts due to precisely chosen step-by-step deformations in the constructions. The smallest fine-tuning step of 0.1 /spl mu/m is measured using laser support adjustment. The system is packaged and can be temperature controlled. At a constant chip temperature of 22/spl deg/C, the package is successfully tested at an ambient temperature range of 0/spl deg/C to 60/spl deg/C. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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