Development of a Conductive Polymer Based Novel 1-DOF Tactile Sensor with Cylindrical Arch Spring Structure Using 3D Printing Technology
| Autor: | Eranga De Silva, Isuru Udayanga, W. H. Peshan Sampath, Ranjith Amarasinghe, Lakshitha Sameera, Atsushi Mitani, Sampath Weragoda |
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| Jazyk: | angličtina |
| Rok vydání: | 2019 |
| Předmět: |
Materials science
sensor phenomena and characterization 3D printing Mechanical engineering springs 02 engineering and technology Silicone rubber lcsh:Chemical technology 01 natural sciences Biochemistry Article Analytical Chemistry chemistry.chemical_compound Deflection (engineering) lcsh:TP1-1185 Electrical and Electronic Engineering Instrumentation Signal conditioning Conductive polymer sensor structures business.industry 010401 analytical chemistry 021001 nanoscience & nanotechnology Atomic and Molecular Physics and Optics Finite element method 0104 chemical sciences Microcontroller three-dimensional displays chemistry 0210 nano-technology business tactile sensors Tactile sensor |
| Zdroj: | Sensors Volume 19 Issue 2 Sensors, Vol 19, Iss 2, p 318 (2019) Sensors (Basel, Switzerland) |
| ISSN: | 1424-8220 |
| DOI: | 10.3390/s19020318 |
| Popis: | Under this research, a novel tactile sensor has been developed using a conductive polymer-based sensing element. The incorporated sensing element is manufactured by polymer press moulding, where the compound is based on silicone rubber and has enhancements by silica and carbon black, with Silane-69 as the coupling agent. Characteristics of the sensing element have been observed using its sensitivity and range, where its results pose an inherent nonlinearity of conductive polymers. For the force scaling purpose, a novel 3D printed cylindrical arch spring structure was developed for this highly customizable tactile sensor by adopting commonly available ABSplus material in 3D printing technology. By considering critical dimensions of the structure, finite element analysis was carried out to achieve nearly optimized results. A special electrical routing arrangement was also designed to reduce the routing complexities. The optimized structure was fabricated using the 3D printing technology. A microcontroller-based signal conditioning circuit was introduced to the system for the purpose of acquiring data. The sensor has been tested up to the maximum load condition using a force indenter. This sensor has a maximum applicable range of 90 N with a maximum structural deflection of 4 mm. The sensor assembly weighs 155 g and the outer dimensions are 85 mm in diameter and 83 mm in height. |
| Databáze: | OpenAIRE |
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