Synthesis, structural, and thermal characterization of a new binuclear copper(II) chelate complex bearing an amine-hardener for epoxy resins
| Autor: | Oleg Mykhalichko, Volodymyr Olijnyk, Borys Mykhalichko, Helen Lavrenyuk, Bartosz Zarychta |
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| Jazyk: | angličtina |
| Rok vydání: | 2016 |
| Předmět: |
differential thermal analysis
fire retardant-hardeners of epoxy resins Copper(II) chelate complexes synthesis Hydrogen bond Dimer Thermal decomposition Inorganic chemistry chemistry.chemical_element 010402 general chemistry 010403 inorganic & nuclear chemistry X-ray crystal structure 01 natural sciences Copper 0104 chemical sciences chemistry.chemical_compound Crystallography Bipyramid chemistry Octahedron IR spectroscopy Differential thermal analysis Diethylenetriamine Materials Chemistry Physical and Theoretical Chemistry |
| Zdroj: | Journal of Coordination Chemistry. 69(18):2666-2676 |
| ISSN: | 0095-8972 |
| Popis: | A new di(μ-carbonato)bis[aqua(diethylenetriamine)copper(II)] hexahydrate complex, [{Cu(NH(C2H4NH2)2)(H2O)(μ-CO3)}2]⋅6H2O (1), was synthesized by direct interaction of malachite with diethylenetriamine (dien). The crystals of 1 were characterized by X-ray powder diffraction and IR spectra, as well as structurally characterized. Compound 1 consists of [{Cu(dien)(H2O)(μ-CO3)}2] discrete units whose CO32– anions play the role of bridging ligands combining two Cu(II) chelate cores into a centrosymmetric dimer. The elongated octahedral environment of Cu2+ consists of three nitrogens of dien and an oxygen from CO32– at the base of the bipyramid; the two apical positions of such polyhedron are occupied by an oxygen from an adjacent CO32– and an O from H2O. Combining the primary dimers into a framework is provided by O–H…O and N–H…O hydrogen bonds. The thermal behavior of 1 was investigated by differential thermal analysis. Thermal decomposition of 1 terminates at 400 °C, while the maximal combustion temperature of gaseous products is at 520 °C. Complex 1 may be an effective fire retardant and, at the same time, a curing agent for epoxy resins. |
| Databáze: | OpenAIRE |
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