Influence of PCB and Connections on the Electromagnetic Conducted Emissions for Electric or Hybrid Vehicle Application

Autor: Mohamed Bensetti, Amin Frikha, Fabrice Duval, Habib Boulzazen
Přispěvatelé: Institut de Recherche en Systèmes Electroniques Embarqués (IRSEEM), Université de Rouen Normandie (UNIROUEN), Normandie Université (NU)-Normandie Université (NU)-École Supérieure d’Ingénieurs en Génie Électrique (ESIGELEC), Supélec Sciences des Systèmes (E3S), Ecole Supérieure d'Electricité - SUPELEC (FRANCE), BENSETTI, Mohamed
Jazyk: angličtina
Rok vydání: 2013
Předmět:
Zdroj: IEEE Transactions on Magnetics
IEEE Transactions on Magnetics, Institute of Electrical and Electronics Engineers, 2013, 49 (5), pp.1841-1844. ⟨10.1109/TMAG.2013.2242440⟩
IEEE Transactions on Magnetics, 2013, 49 (5), pp.1841-1844. ⟨10.1109/TMAG.2013.2242440⟩
ISSN: 0018-9464
DOI: 10.1109/TMAG.2013.2242440⟩
Popis: International audience; This paper presents a fine modeling method for power module used in an Electric or Hybrid Vehicle (EHV) application. A time domain model is developed in order to predict conducted emissions. All parasitic elements of the power components constituting the power module are obtained by modeling, measuring or applying analytical formula. The influence of the Printed Circuit Board (PCB) and the connections of components on conducted emissions levels are shown here. The results obtained by the proposed models are compared with measurements results.
Databáze: OpenAIRE