Solving thermal issues in tensile-strained Ge microdisks
| Autor: | F. Bœuf, Philippe Boucaud, Anas Elbaz, Isabelle Sagnes, M. El Kurdi, Sébastien Sauvage, Xavier Checoury, Abdelhanin Aassime |
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| Přispěvatelé: | Centre de Nanosciences et de Nanotechnologies [Marcoussis] (C2N), Université Paris-Sud - Paris 11 (UP11)-Centre National de la Recherche Scientifique (CNRS), STMicroelectronics [Crolles] (ST-CROLLES) |
| Jazyk: | angličtina |
| Rok vydání: | 2018 |
| Předmět: |
[PHYS]Physics [physics]
Photoluminescence Materials science business.industry Stacking 02 engineering and technology Dielectric Heat sink 021001 nanoscience & nanotechnology 01 natural sciences 7. Clean energy Atomic and Molecular Physics and Optics 010309 optics Optical pumping [SPI]Engineering Sciences [physics] Optics Pedestal 0103 physical sciences [SPI.OPTI]Engineering Sciences [physics]/Optics / Photonic Optoelectronics Continuous wave Photonics [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics 0210 nano-technology business |
| Zdroj: | Optics Express Optics Express, Optical Society of America-OSA Publishing, 2018, ⟨10.1364/OE.26.028376⟩ |
| ISSN: | 1094-4087 |
| Popis: | International audience; We propose to use a Ge-dielectric-metal stacking to allow one to address both thermal management with the metal as an efficient heat sink and tensile strain engineering with the buried dielectric as a stressor layer. This scheme is particularly useful for the development of Ge-based optical sources. We demonstrate experimentally the relevance of this approach by comparing the optical response of tensile-strained Ge microdisks with an Al heat sink or an oxide pedestal. Photoluminescence indicates a much reduced temperature rise in the microdisk (16 K with Al pedestal against 200 K with SiO 2 pedestal under a 9 mW continuous wave optical pumping). An excellent agreement is found with finite element modeling of the temperature rise. This original stacking combining metal and dielectrics is promising for integrated photonics where thermal management is an issue. |
| Databáze: | OpenAIRE |
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