Adhesive Contamination Removal through Improvement at Package Sawing Process
| Autor: | Alvin S. Soreda, Ernesto T. Antilano Jr. |
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| Rok vydání: | 2019 |
| Předmět: | |
| DOI: | 10.5281/zenodo.3540641 |
| Popis: | Package sawing process in semiconductor assembly manufacturing is a process typically performed to separate integrated circuit packages such as IC chips from a substrate / leadframe in order to form the individual units. |
| Databáze: | OpenAIRE |
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