Foreword: Special Section on Electrical Performance for Highly Integrated Systems

Autor: Xavier, Pascal
Přispěvatelé: Institut de Microélectronique, Electromagnétisme et Photonique - Laboratoire d'Hyperfréquences et Caractérisation (IMEP-LAHC), Université Savoie Mont Blanc (USMB [Université de Savoie] [Université de Chambéry])-Centre National de la Recherche Scientifique (CNRS)-Université Grenoble Alpes (UGA)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP ), Université Grenoble Alpes (UGA)
Jazyk: angličtina
Rok vydání: 2020
Předmět:
Zdroj: IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology, Institute of Electrical and Electronics Engineers, 2020, 10 (11), pp.1767-1768. ⟨10.1109/TCPMT.2020.3035950⟩
ISSN: 2156-3950
DOI: 10.1109/TCPMT.2020.3035950⟩
Popis: Not a day goes by without the issue of global warming and the depletion of the planet’s resources being addressed in the media. And it is clear that the societal and environmental challenges posed are of considerable magnitude because we all must drastically reduce our carbon footprint. At the same time, the amount of data exchanged around the world is constantly increasing. Do we need to be reminded once again of the extent to which our global data infrastructures have made it possible, and are still making it possible, to fight the COVID-19 pandemic with all the necessary strength?
Databáze: OpenAIRE