Electrochemical Alloying of Copper Substrate with Tin Using Ionic Liquid as an Electrolyte at Medium-Low Temperatures
| Autor: | Tetsuji Hirato, Yasuhiro Awakura, Kuniaki Murase, Takuma Katase, Hiroyuki Sugimura, Ryoichi Kurosaki |
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| Rok vydání: | 2007 |
| Předmět: |
Materials science
Renewable Energy Sustainability and the Environment Inorganic chemistry Alloy Intermetallic chemistry.chemical_element Electrolyte engineering.material Condensed Matter Physics Electrochemistry Copper Surfaces Coatings and Films Electronic Optical and Magnetic Materials chemistry.chemical_compound chemistry Phase (matter) Ionic liquid Materials Chemistry engineering Tin |
| Zdroj: | Journal of The Electrochemical Society. 154:D612 |
| ISSN: | 0013-4651 |
| DOI: | 10.1149/1.2776230 |
| Popis: | Electrochemical alloying of Cu substrate through a reduction-diffusion method was investigated using ionic liquid, trimethyl-n-hexylammonium bis[(trifluoromethyl)sulfonyl]amide, as a solvent for an electrolytic bath. The use of the ionic liquid rendered it possible to raise the processing temperature beyond 100 åC so as to form the Cu-Sn layers faster than in the case of an aqueous media. The layers obtained from Cu thin layer under potentiostatic condition were silver-gray speculum metal composed of Cu6Sn5, Cu3Sn, and Cu10Sn3 intermetallic phases, while those prepared under galvanic contact condition involved a β-Sn phase containing a trace amount of copper. The formation of each Cu-Sn phase was discussed in terms of thermodynamics of alloy formation. |
| Databáze: | OpenAIRE |
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