Controlled Mechanical Cracking of Metal Films Deposited on Polydimethylsiloxane (PDMS)
Autor: | Patrick Görrn, Timo Jakob, Andreas Polywka, Oliver Krauledat, Luca Stegers, Thomas Riedl |
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Jazyk: | angličtina |
Rok vydání: | 2016 |
Předmět: |
Materials science
General Chemical Engineering stretchable cracking 02 engineering and technology 010402 general chemistry 01 natural sciences law.invention lcsh:Chemistry chemistry.chemical_compound law PDMS Deposition (phase transition) General Materials Science silver Electronics Thin film Composite material Electrical conductor Lithography electroless deposition Polydimethylsiloxane Communication 021001 nanoscience & nanotechnology 0104 chemical sciences Cracking chemistry lcsh:QD1-999 lithography Photolithography 0210 nano-technology control |
Zdroj: | Nanomaterials Nanomaterials, Vol 6, Iss 9, p 168 (2016) |
ISSN: | 2079-4991 |
Popis: | Stretchable large area electronics conform to arbitrarily-shaped 3D surfaces and enables comfortable contact to the human skin and other biological tissue. There are approaches allowing for large area thin films to be stretched by tens of percent without cracking. The approach presented here does not prevent cracking, rather it aims to precisely control the crack positions and their orientation. For this purpose, the polydimethylsiloxane (PDMS) is hardened by exposure to ultraviolet radiation (172 nm) through an exposure mask. Only well-defined patterns are kept untreated. With these soft islands cracks at the hardened surface can be controlled in terms of starting position, direction and end position. This approach is first investigated at the hardened PDMS surface itself. It is then applied to conductive silver films deposited from the liquid phase. It is found that statistical (uncontrolled) cracking of the silver films can be avoided at strain below 35%. This enables metal interconnects to be integrated into stretchable networks. The combination of controlled cracks with wrinkling enables interconnects that are stretchable in arbitrary and changing directions. The deposition and patterning does not involve vacuum processing, photolithography, or solvents. |
Databáze: | OpenAIRE |
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