Programmed line width roughness metrology by multitechniques approach

Autor: Yoann Blancquaert, Jérôme Reche, Guillaume Freychet, Patrice Gergaud, Thibault Labbaye, Maxime Besacier
Přispěvatelé: Laboratoire des technologies de la microélectronique (LTM ), Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Centre National de la Recherche Scientifique (CNRS)-Université Grenoble Alpes [2016-2019] (UGA [2016-2019]), Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information (CEA-LETI), Direction de Recherche Technologique (CEA) (DRT (CEA)), Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA)
Rok vydání: 2018
Předmět:
Zdroj: Journal of Micro/Nanolithography, MEMS, and MOEMS
Journal of Micro/Nanolithography, MEMS, and MOEMS, Society of Photo-optical Instrumentation Engineers, 2018, 17 (04), pp.1. ⟨10.1117/1.JMM.17.4.041005⟩
Journal of Micro/Nanolithography, MEMS, and MOEMS, 2018, 17 (04), pp.1. ⟨10.1117/1.JMM.17.4.041005⟩
ISSN: 1932-5150
Popis: At modern manufacturing geometries, roughness control presents a huge challenge for the lithography step. For advanced nodes, this morphological aspect reaches the same order of magnitude as the critical dimension (CD). Hence, the control of roughness needs an adapted metrology. Specific samples with designed roughness have been manufactured using e-beam lithography. These samples have been characterized with three different methodologies: CD-scanning electron microscopy, optical critical dimension, and small angle x-ray scattering. The main goal is to compare the capability of each of these techniques in terms of reliability, type of information obtained, time to obtain the measurements, and level of maturity for the industry. The next step will be to develop a hybrid metrology approach for roughness determination with these techniques.
Databáze: OpenAIRE