Carbon nanotube array as high impedance interconnects for sensing device integration
| Autor: | Chin Chong Yap, Dominique Baillargeat, Jean-Luc Reverchon, David Hee, Dunlin Tan, Beng Kang Tay, Philippe Bois, JongJen Yu |
|---|---|
| Přispěvatelé: | MINACOM (XLIM-MINACOM), XLIM (XLIM), Université de Limoges (UNILIM)-Centre National de la Recherche Scientifique (CNRS)-Université de Limoges (UNILIM)-Centre National de la Recherche Scientifique (CNRS), CINTRA / SEEE Nanyang Technological University, Nanyang Technological University [Singapour], SEEE Nanyang Technological University, Nanyang Technological University [Singapour]-Nanyang Technological University [Singapour], THALES Singapore, 3-5 Lab |
| Rok vydání: | 2013 |
| Předmět: |
Materials science
Silicon chemistry.chemical_element Nanotechnology Hardware_PERFORMANCEANDRELIABILITY 02 engineering and technology Carbon nanotube 01 natural sciences Signal law.invention Computer Science::Hardware Architecture High impedance Potential applications of carbon nanotubes law 0103 physical sciences Hardware_INTEGRATEDCIRCUITS [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics Electronic circuit 010302 applied physics business.industry 021001 nanoscience & nanotechnology Chip chemistry Stiction Optoelectronics 0210 nano-technology business Hardware_LOGICDESIGN |
| Zdroj: | Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, May 2013, United States. pp.154-158 |
| Popis: | In next generation sensing architectures, compact systems that could enhance manoeuvrability and at the same time diversify sensing capability is similarly carried out through pitch size reduction to incorporate more pixels per unit area. This is because integration of these sensors to its Si read-out circuits has to be technologically compatible for proper signal digitization. In the case of metal interconnects, further down-scaling could lead to higher failure rate, mismatch in coefficient of thermal expansion. In this study, optical interconnects between the sensors and Si read-out circuits using vertically aligned carbon nanotubes arrays in place of indium bump arrays were investigated. Due to the low thermal budget of the sensing device and read-out circuits, vertically aligned carbon nanotube arrays were fabricated at low temperatures. Its material characteristics would be shown. The high dense carbon nanotubes were vertically bonded like in a flip-chip bonding process. Carbon nanotubes from the top chip were inserted between adjacent tubes of the bottom chip. As a result of the close proximity of individual tubes, such arrays could adhere the sensor to the read-out circuits due to stiction at the microscopic scale. This `velcro' effect could be achieved due to its dense but fin-like structure. Individual bundles of interconnected carbon nanotubes could be equivalent to one pixel. Electro-optical measurements showing its feasibility of using it as optical interconnects for high impedance devices would be evaluated. |
| Databáze: | OpenAIRE |
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