Influence of Si Coating on Interfacial Microstructure of Laser Joining of Titanium and Aluminium Alloys
| Autor: | André Felipe Ribeiro Moreira, Rogério Moraes Oliveira, Aline Capella de Oliveira, Rudimar Riva, C.B. Mello |
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| Jazyk: | angličtina |
| Rok vydání: | 2017 |
| Předmět: |
joining process
Materials science Silicon chemistry.chemical_element 02 engineering and technology 01 natural sciences Aluminium 0103 physical sciences Aluminium alloy General Materials Science Ti-6Al-4V Materials of engineering and construction. Mechanics of materials 010302 applied physics Mechanical Engineering Metallurgy Titanium alloy AA6013 Sputter deposition 021001 nanoscience & nanotechnology Condensed Matter Physics Microstructure chemistry Mechanics of Materials visual_art visual_art.visual_art_medium Butt joint TA401-492 0210 nano-technology dissimilar metals Titanium |
| Zdroj: | Materials Research, Volume: 21, Issue: 1, Article number: e20161109, Published: 09 NOV 2017 Materials Research v.21 n.1 2018 Materials research (São Carlos. Online) Universidade Federal de São Carlos (UFSCAR) instacron:ABM ABC ABPOL Materials Research, Vol 21, Iss 1 (2017) Materials Research, Issue: ahead, Published: 09 NOV 2017 |
| Popis: | A common phenomenon in the dissimilar joints is the presence of brittle compounds in the joining interface region. The brittle phases can decrease by introduction of interlayers in the joining interface, such as silicon, that inhibits the formation of Al3Ti and AlTi3 phases in joining process between titanium and aluminium alloys. In the present work, the joining of titanium and aluminium alloys have been carried out using a Yb:fiber laser, considering the prior silicon film deposited on titanium alloy interface by DC magnetron sputtering. Butt joint conditions were maintained constant: laser average power, process speed and beam positioning along the interface joining toward aluminium alloy (1200 W, 3.0 m/min and 0.3 mm, respectively). Metallographic analyses were carried out on the cross-section joint by optical and electronic microscopies. When the melted aluminium alloy wet the solid-state titanium alloy, a more restrict compound layer was formed in the joining interface. EDS line scanning in the joining interface showed a reduction of compound layer thickness, considering the silicon as interlayer, reaching the mean value of 3 µm, i.e., up to five times thinner if compared to joining without silicon during the process. |
| Databáze: | OpenAIRE |
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