FIB-based technique for stress characterization on thin films for reliability purposes
| Autor: | J. Keller, Astrid Gollhardt, Neus Sabaté, Dietmar Vogel, Carles Cané, J. Marcos, Bruno Michel, I. Grícia |
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| Přispěvatelé: | Publica |
| Rok vydání: | 2007 |
| Předmět: |
Materials science
Mechanical engineering Condensed Matter Physics Focused ion beam Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Characterization (materials science) Stress (mechanics) Residual stress Forensic engineering Miniaturization Electrical and Electronic Engineering Thin film Reliability (statistics) Microscale chemistry |
| Zdroj: | Microelectronic Engineering. 84:1783-1787 |
| ISSN: | 0167-9317 |
| DOI: | 10.1016/j.mee.2007.01.272 |
| Popis: | This paper describes a novel approach of stress measurement based on the combined imaging-milling capabilities of a FIB equipment. This technique consists on the scaling down of two measurement techniques based on stress-relaxation, the slot and the hole-drilling methods. The main aspects of both approaches at a microscale are described and illustrated and some examples of their application to thin films are presented. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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