3D integration ESD protection design and analysis

Autor:	Koushik Ramachandran, Robert J. Gauthier, Thuy Tran-Quinn, You Li, Christy S. Tyberg, Matthew Angyal, Joel Abraham Silberman, Ephrem G. Gebreselasie, Katsuyuki Sakuma, Souvick Mitra
Rok vydání:	2015
Předmět:	Engineering Electrostatic discharge business.industry Circuit performance Design of experiments Process (computing) Hardware_PERFORMANCEANDRELIABILITY Chip Hardware_INTEGRATEDCIRCUITS Electronic engineering Leakage test business Hardware_LOGICDESIGN Degradation (telecommunications)
Zdroj:	Scopus-Elsevier
Popis:	A Design of Experiments (DOEs) matrix was created to evaluate probability of fails during a complex 3D integration process as a function of ESD protection level. A detailed set of pass/fail criteria based on circuit performance was established. Based on measured samples, functionality test and leakage test show circuit performance degradation and larger fail rate after chip bonding on designs without ESD protection.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_dedup___::26c2916a0cb044455f603ec1f51f6ced https://doi.org/10.1109/eosesd.2015.7314791 Zobrazit plný text záznamu