Flip-Chip Integration of InP and SiN
| Autor: | Ronald Dekker, Rene Heideman, Frederik Schreuder, Kerstin Worhoff, Ruud M. Oldenbeuving, A. Sigmund, Richard Mateman, Karl-Otto Velthaus, F. M. Postma, Dimitri Geskus, Lennart Wevers, Martin Moehrle, Michael Theurer, Martin Schell |
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| Přispěvatelé: | Publica |
| Rok vydání: | 2019 |
| Předmět: |
Coupling
Materials science business.industry Interface (computing) Physics::Optics Optical power 02 engineering and technology Chip Laser Waveguide (optics) Atomic and Molecular Physics and Optics Electronic Optical and Magnetic Materials law.invention 020210 optoelectronics & photonics law Hardware_INTEGRATEDCIRCUITS 0202 electrical engineering electronic engineering information engineering Optoelectronics Electrical and Electronic Engineering Photonics business Flip chip |
| Zdroj: | IEEE Photonics Technology Letters. 31:273-276 |
| ISSN: | 1941-0174 1041-1135 |
| Popis: | We present an interface for hybrid flip-chip integration of InP-based laser sources to silicon-nitride-based photonic platforms. The design enables efficient high optical power coupling over a wide temperature range. The optical modes of laser and SiN chip are expanded using integrated tapers allowing for high alignment tolerance. The chips comprise physical alignment stops for vertical alignment. In the horizontal direction, the integration interface is optimized for active and/or visual alignment with high precision using precise visual alignment marks. The hybrid integrated chip shows a waveguide coupled optical power of more than 40 mW and can operate at elevated temperatures up to 85 °C. |
| Databáze: | OpenAIRE |
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