Viscous flow and viscosity measurement of low-temperature imprintable AuCuSi thin film metallic glasses investigated by nanoindentation creep
Autor: | Cheng Wang, Jinn P. Chu, Yi-Chia Liao, Chun-Hway Hsueh |
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Jazyk: | angličtina |
Rok vydání: | 2017 |
Předmět: |
010302 applied physics
Materials science Amorphous metal Mechanical Engineering 02 engineering and technology Nanoindentation 021001 nanoscience & nanotechnology 01 natural sciences Amorphous solid Condensed Matter::Soft Condensed Matter Physics::Fluid Dynamics Viscosity Creep Mechanics of Materials Indentation 0103 physical sciences lcsh:TA401-492 General Materials Science lcsh:Materials of engineering and construction. Mechanics of materials Deformation (engineering) Composite material 0210 nano-technology Glass transition |
Zdroj: | Materials & Design, Vol 123, Iss, Pp 112-119 (2017) |
ISSN: | 0264-1275 |
Popis: | The viscous flow typically plays an important role for the deformation of metallic glasses in the supercooled liquid region. This deformation behavior has been widely investigated for bulk metallic glasses. However, studies on the viscous flow and viscosity measurement of thin film metallic glasses (TFMGs) were sparse. In this work, we synthesized four compositions of fully amorphous AuCuSi TFMGs by magnetron sputtering. The glass transition temperature, which is also the temperature of the critical transition point from elastic/plastic deformation to time-dependent viscous flow, was determined using nanoindentation. The nanoindentation creep tests performed with hemispherical and Berkovich indenter tips in the temperature range of 50 to 170 °C were proven to be suitable for the viscosity measurements of AuCuSi TFMGs. The activation energy of the flow process was also evaluated from the indentation results and good agreement was obtained between the results evaluated from hemispherical and Berkovich tips. Finally, a nano-scaled imprinted AuCuSi TFMG showed great topological resolution. Keywords: Metallic glass, Thin film, Nanoindentation, Rheology, Thermal imprint |
Databáze: | OpenAIRE |
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