Building blocks of a flip-chip integrated superconducting quantum processor
| Autor: | Sandoko Kosen, Hang-Xi Li, Marcus Rommel, Daryoush Shiri, Christopher Warren, Leif Grönberg, Jaakko Salonen, Tahereh Abad, Janka Biznárová, Marco Caputo, Liangyu Chen, Kestutis Grigoras, Göran Johansson, Anton Frisk Kockum, Christian Križan, Daniel Pérez Lozano, Graham J Norris, Amr Osman, Jorge Fernández-Pendás, Alberto Ronzani, Anita Fadavi Roudsari, Slawomir Simbierowicz, Giovanna Tancredi, Andreas Wallraff, Christopher Eichler, Joonas Govenius, Jonas Bylander |
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| Jazyk: | angličtina |
| Rok vydání: | 2022 |
| Předmět: |
Quantum Physics
Other Electrical Engineering Electronic Engineering Information Engineering Physics and Astronomy (miscellaneous) transmon Materials Science (miscellaneous) gate fidelities coherence times superconducting qubit FOS: Physical sciences Hardware_PERFORMANCEANDRELIABILITY Control Engineering design and simulation Atomic and Molecular Physics and Optics Computer Science::Hardware Architecture flip-chip integration Computer Science::Emerging Technologies Hardware_INTEGRATEDCIRCUITS Computer Engineering Electrical and Electronic Engineering Hardware_ARITHMETICANDLOGICSTRUCTURES Quantum Physics (quant-ph) |
| Zdroj: | Kosen, S, Li, H X, Rommel, M, Shiri, D, Warren, C, Grönberg, L, Salonen, J, Abad, T, Biznárová, J, Caputo, M, Chen, L, Grigoras, K, Johansson, G, Kockum, A F, Križan, C, Lozano, D P, Norris, G J, Osman, A, Fernández-Pendás, J, Ronzani, A, Roudsari, A F, Simbierowicz, S, Tancredi, G, Wallraff, A, Eichler, C, Govenius, J & Bylander, J 2022, ' Building blocks of a flip-chip integrated superconducting quantum processor ', Quantum Science and Technology, vol. 7, no. 3, 035018 . https://doi.org/10.1088/2058-9565/ac734b Quantum Science and Technology vol.7(2022) |
| ISSN: | 2058-9565 |
| Popis: | We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips -- one quantum chip and one control chip -- that are bump-bonded together. We demonstrate time-averaged coherence times exceeding $90\,\mu s$, single-qubit gate fidelities exceeding $99.9\%$, and two-qubit gate fidelities above $98.6\%$. We also present device design methods and discuss the sensitivity of device parameters to variation in interchip spacing. Notably, the additional flip-chip fabrication steps do not degrade the qubit performance compared to our baseline state-of-the-art in single-chip, planar circuits. This integration technique can be extended to the realisation of quantum processors accommodating hundreds of qubits in one module as it offers adequate input/output wiring access to all qubits and couplers. Comment: 33 pages, 12 figures, includes supplementary materials, updated with further calculations on participation ratio and Purcell limit |
| Databáze: | OpenAIRE |
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