Remote Driven and Read MEMS Sensors for Harsh Environments
| Autor: | Faisal Razi Ahmad, David William Vernooy, Daniel White Sexton, Aaron Jay Knobloch |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 2013 |
| Předmět: |
Engineering
Transducers microelectromechanical devices Information Storage and Retrieval lcsh:Chemical technology Biochemistry Article Analytical Chemistry high temperature Resonator Electric Power Supplies Comb drive Hardware_GENERAL Electronic engineering Wireless lcsh:TP1-1185 acoustic resonator Electrical and Electronic Engineering Instrumentation Ecosystem Microelectromechanical systems business.industry Electrical engineering Resonance Equipment Design Micro-Electrical-Mechanical Systems Mems sensors Atomic and Molecular Physics and Optics electromagnetic coupling Equipment Failure Analysis Transducer Remote Sensing Technology business Wireless Technology |
| Zdroj: | Sensors Volume 13 Issue 10 Pages 14175-14188 Sensors (Basel, Switzerland) Sensors, Vol 13, Iss 10, Pp 14175-14188 (2013) |
| ISSN: | 1424-8220 |
| DOI: | 10.3390/s131014175 |
| Popis: | The utilization of high accuracy sensors in harsh environments has been limited by the temperature constraints of the control electronics that must be co-located with the sensor. Several methods of remote interrogation for resonant sensors are presented in this paper which would allow these sensors to be extended to harsh environments. This work in particular demonstrates for the first time the ability to acoustically drive a silicon comb drive resonator into resonance and electromagnetically couple to the resonator to read its frequency. The performance of this system was studied as a function of standoff distance demonstrating the ability to excite and read the device from 22 cm when limited to drive powers of 30 mW. A feedback architecture was implemented that allowed the resonator to be driven into resonance from broadband noise and a standoff distance of 15 cm was demonstrated. It is emphasized that no junction-based electronic device was required to be co-located with the resonator, opening the door for the use of silicon-based, high accuracy MEMS devices in high temperature wireless applications. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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