Eco-Friendly Phenol–Urea–Formaldehyde Co-condensed Resin Adhesives Accelerated by Resorcinol for Plywood Manufacturing
| Autor: | Guan-Ben Du, Ming-Kan Li, Run-Cang Sun, Yang Sheng, Tong-Qi Yuan, Pang Bo |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 2018 |
| Předmět: |
0106 biological sciences
Thermogravimetric analysis Materials science General Chemical Engineering Urea-formaldehyde Formaldehyde technology industry and agriculture 02 engineering and technology General Chemistry Resorcinol Calorimetry 021001 nanoscience & nanotechnology 01 natural sciences Article lcsh:Chemistry chemistry.chemical_compound chemistry Chemical engineering stomatognathic system lcsh:QD1-999 010608 biotechnology Phenol Adhesive 0210 nano-technology Curing (chemistry) |
| Zdroj: | ACS Omega, Vol 3, Iss 8, Pp 8521-8528 (2018) ACS Omega |
| ISSN: | 2470-1343 |
| Popis: | Eco-friendly and good-performance resin adhesives are needed for wood manufacturing. In this study, phenol–urea–formaldehyde (PUF) resin adhesives were modified by adding various ratios of resorcinol. The properties of PUF, phenol–resorcinol–urea–formaldehyde (PRUF) resin adhesives, and the performances of the prepared plywood were tested. The curing behaviors and the structural features of the PUF and PRUF resin adhesives were investigated via dynamic scanning calorimetry, thermal gravimetric analysis, 13C NMR, and cross polarization magic angle spinning 13C NMR. The results indicated that 1.3% resorcinol (based on resin, w/w) could decrease the curing temperature and accelerate the curing process after PUF resin modification. The PRUF resin adhesives demonstrated a lower activation energy during the curing process, with up to 28.8% less energy than that of PUF resin adhesive without any curing agent. The plywood demonstrated low formaldehyde emissions (1.00 MPa). This work provided a method for preparing an easy-cured and high-performance phenolic resin for wood manufacturing. |
| Databáze: | OpenAIRE |
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