Formulation of Screen-Printable Cu Molecular Ink for Conductive/Flexible/Solderable Cu Traces
| Autor: | Xiangyang Liu, Arnold J. Kell, Thomas Lacelle, Chantal Paquet, Sylvie Lafrenière, Gregory P. Lopinski, Olga Mozenson, Patrick R. L. Malenfant, Greg Brzezina, Bhavana A. Deore, Chang Guo |
|---|---|
| Rok vydání: | 2019 |
| Předmět: |
Fabrication
Materials science Reflow oven soldering 02 engineering and technology 010402 general chemistry 021001 nanoscience & nanotechnology 01 natural sciences metal-organic decomposition 0104 chemical sciences Kapton conductive molecular ink printed flexible electronics Printed electronics Soldering Electrode Screen printing General Materials Science Wafer IPL sintering Composite material 0210 nano-technology |
| Zdroj: | ACS Applied Materials & Interfaces. 11:38880-38894 |
| ISSN: | 1944-8252 1944-8244 |
| Popis: | Screen printing is the most common method used for the production of printed electronics. Formulating copper (Cu) inks that yield conductive fine features with oxidation and mechanical robustness on low-temperature substrates will open up opportunities to fabricate cost-effective devices. We have formulated a screen-printable Cu metal-organic decomposition (MOD) ink comprising Cu formate coordinated to 3-(diethylamino)-1,2-propanediol, a fractional amount of Cu nanoparticles (CuNPs), and a binder. This simple formulation enables ∼70–550 μm trace widths with excellent electrical [∼8–15 mΩ/□/mil or 20–38 μΩ·cm] and mechanical properties with submicron-thick traces obtained by intense pulse light (IPL) sintering on Kapton and poly(ethylene terephthalate) (PET) substrates. These traces are mechanically robust to flexing and creasing where less than 10% change in resistance is observed on Kapton and ∼20% change is observed on PET. Solderable Cu traces were obtained only with the combination of the Cu MOD precursor, CuNP, and polymer binder. Both thermally and IPL sintered traces showed shelf stability ( |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|