Thermal vulnerability detection in integrated electronic and photonic circuits using infrared thermography
| Autor: | Davide Moroni, Bushra Jalil, Bilal Hussain, Maria Antonietta Pascali, Paolo Ghelfi, Giovanni Serafino, Muhammad Imran |
|---|---|
| Rok vydání: | 2020 |
| Předmět: |
FOS: Computer and information sciences
I.4 Computer science Computer Vision and Pattern Recognition (cs.CV) Computer Science - Computer Vision and Pattern Recognition Infrared imaging FOS: Physical sciences Integrated circuit Applied Physics (physics.app-ph) 01 natural sciences law.invention 010309 optics Optics law High-temperature operating life 0103 physical sciences Electronic engineering Electrical and Electronic Engineering Engineering (miscellaneous) Electronic circuit Digital electronics business.industry Physics - Applied Physics Atomic and Molecular Physics and Optics Photonic circuits Semiconductor visual_art Thermography Electronic component visual_art.visual_art_medium Device under test Photonics business |
| Zdroj: | Applied optics (2004, Online) 59 (2020): E97–E106. doi:10.1364/AO.389960 info:cnr-pdr/source/autori:Hussain B.; Jalil B.; Pascali M.A.; Imran M.; Serafino G.; Moroni D.; Ghelfi P./titolo:Thermal vulnerability detection in integrated electronic and photonic circuits using infrared thermography/doi:10.1364%2FAO.389960/rivista:Applied optics (2004, Online)/anno:2020/pagina_da:E97/pagina_a:E106/intervallo_pagine:E97–E106/volume:59 |
| ISSN: | 1539-4522 |
| Popis: | Failure prediction of any electrical/optical component is crucial for estimating its operating life. Using high temperature operating life (HTOL) tests, it is possible to model the failure mechanisms for integrated circuits. Conventional HTOL standards are not suitable for operating life prediction of photonic components owing to their functional dependence on thermo-optic effect. This work presents an IR-assisted thermal vulnerability detection technique suitable for photonic as well as electronic components. By accurately mapping the thermal profile of an integrated circuit under a stress condition, it is possible to precisely locate the heat center for predicting the long-term operational failures within the device under test. For the first time, the reliability testing is extended to a fully functional microwave photonic system using conventional IR thermography. By applying image fusion using affine transformation on multimodal acquisition, it was demonstrated that by comparing the IR profile and GDSII layout, it is possible to accurately locate the heat centers along with spatial information on the type of component. Multiple IR profiles of optical as well as electrical components/circuits were acquired and mapped onto the layout files. In order to ascertain the degree of effectiveness of the proposed technique, IR profiles of CMOS RF and digital circuits were also analyzed. The presented technique offers a reliable automated identification of heat spots within a circuit/system. Comment: 2020 Optical Society of America. One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modifications of the content of this paper are prohibited |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|