Increasing the accuracy of 3D EEG implantations

Autor:	Aidan G. O'Keeffe, Vejay N. Vakharia, Michele Rizzi, Mark Nowell, Andrew W. McEvoy, Victoria Wykes, Sofia H Eriksson, Anna Miserocchi, Roman Rodionov, Sebastien Ourselin, John S. Duncan
Rok vydání:	2020
Předmět:	medicine.diagnostic_test business.industry medicine General Medicine Electroencephalography business Quality assurance Stereoelectroencephalography Biomedical engineering
Zdroj:	Journal of Neurosurgery. 133:35-42
ISSN:	1933-0693 0022-3085
DOI:	10.3171/2019.2.jns183313
Popis:	OBJECTIVEThe accuracy of stereoelectroencephalography (SEEG) electrode implantation is an important factor in maximizing its safety. The authors established a quality assurance (QA) process to aid advances in implantation accuracy.METHODSThe accuracy of three consecutive modifications of a frameless implantation technique was quantified in three cohorts comprising 22, 8, and 23 consecutive patients. The modifications of the technique aimed to increase accuracy of the bolt placement.RESULTSThe lateral shift of the axis of the implanted bolt at the level of the planned entry point was reduced from a mean of 3.0 ± 1.6 mm to 1.4 ± 0.8 mm. The lateral shift of the axis of the implanted bolt at the level of the planned target point was reduced from a mean of 3.8 ± 2.5 mm to 1.6 ± 0.9 mm.CONCLUSIONSThis QA framework helped to isolate and quantify the factors introducing inaccuracy in SEEG implantation, and to monitor ongoing accuracy and the effect of technique modifications.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1914f3d1a2e579e63d4bde7d230a5953 https://doi.org/10.3171/2019.2.jns183313 Zobrazit plný text záznamu