Hermetic packaging for implantable microsystems: effectiveness of sequentially electroplated AuSn alloy
| Autor: | Katarzyna M. Szostak, Timothy G. Constandinou |
|---|---|
| Přispěvatelé: | Engineering & Physical Science Research Council (EPSRC) |
| Rok vydání: | 2018 |
| Předmět: |
Materials science
Alloy Nanotechnology 02 engineering and technology engineering.material 03 medical and health sciences 0302 clinical medicine Microsystem Miniaturization Eutectic bonding Alloys Product Packaging Microtechnology Humans Electroplating Drug Packaging Eutectic system Prostheses and Implants 021001 nanoscience & nanotechnology Resist Tin engineering Gold 0210 nano-technology 030217 neurology & neurosurgery |
| Zdroj: | 40th International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) EMBC |
| Popis: | With modern microtechnology, there is an aggressive miniaturization of smart devices, despite an increasing level of integration and overall complexity. It is therefore becoming increasingly important to be achieve reliable, compact packaging. For implantable medical devices (IMDs), the package must additionally provide a high quality hermetic environment to protect the device from the human body. For chip-scale devices, AuSn eutectic bonding offers the possibility of forming compact seals that achieve ultra-low permeability. A key feature is this can be achieved at process temperatures of below 350315°C, therefore allowing for the integration of sensors and microsystems with CMOS electronics within a single package. Issues however such as solder wetting, void formation and controlling composition make formation of high-quality repeatable seals highly challenging. Towards this aim, this paper presents our experimental work characterizing the eutectic stack deposition. We detail our designmethods and process flow, share our experiences in controlling electrochemical deposition of AuSn alloy and finally discuss usability of sequential electroplating process for the formation of hermetic eutectic bonds. |
| Databáze: | OpenAIRE |
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