Large-Area Laser-Lift-Off Processing in Microelectronics
| Autor: | J. Brune, R. Delmdahl, R. Pätzel |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 2013 |
| Předmět: |
Materials science
medicine.medical_treatment Laser lift-off 02 engineering and technology HB-LED Physics and Astronomy(all) 01 natural sciences 7. Clean energy Flat panel display law.invention Excimer laser Thin wafer debonding law 0103 physical sciences medicine Microelectronics 010302 applied physics business.industry Semiconductor device 021001 nanoscience & nanotechnology Laser Flexible display Thin-film transistor Optoelectronics 0210 nano-technology business Light-emitting diode |
| Popis: | Laser lift-off is an enabling technology for microelectronics growth markets such as light emitting diodes, densely packaged semiconductor devices, and flexible displays. For example, thin film transistor structures fabricated on top of polymer layers spun on glass carriers must be delaminated from rigid substrates to create lightweight and rugged flexible displays on polymers. Low-thermal-budget processes are generically required to protect adjacent functional films. Excimer lasers provide short UV wavelength and short pulse duration required for highly-localized energy coupling. The high output power of excimer lasers enables a large processing footprint and the high-throughput rates needed in mass manufacturing. peerReviewed |
| Databáze: | OpenAIRE |
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