Concept and processing of buried photomasks
| Autor: | P. Moschini, F. Lalanne, Gilles R. Amblard, Jean-Pierre Panabiere, Alain Inard, Jean-Marc Francou, L. Guérin, André Weill |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 1990 |
| Předmět: |
Plasma etching
Fabrication Materials science masks novolak based photoresists Nanotechnology Mascara transparent photoplate planarisation law.invention glass substrate law Etching (microfabrication) [PHYS.HIST]Physics [physics]/Physics archives integrated circuit technology photoresists buried photomasks etching processing Photolithography Photomask lift off vacuum contact printing absorbent patterns Electron-beam lithography |
| Zdroj: | Revue de Physique Appliquée Revue de Physique Appliquée, Société française de physique / EDP, 1990, 25 (8), pp.859-865. ⟨10.1051/rphysap:01990002508085900⟩ |
| ISSN: | 0035-1687 2777-3671 |
| DOI: | 10.1051/rphysap:01990002508085900⟩ |
| Popis: | A new method for fabricating photomasks is proposed. The mask is prepared by burying the absorbent patterns inside the transparent photoplate instead of depositing them on the surface of the photoplate. After imaging and etching trenches into the glass substrate, an absorbent material is set into them. Two different ways of filling in these holes are considered : planarisation and lift-off. Various advantages of this technique are expected, namely high resolution. This paper presents results obtained by vacuum contact printing of positive and negative novolak based photoresists exposed through buried masks. |
| Databáze: | OpenAIRE |
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