A monolithic surface micromachined accelerometer with digital output

Autor:	M. Lemkin, Bernhard E. Boser, C. Lu
Rok vydání:	2002
Předmět:	Fabrication Materials science Silicon business.industry Electrical engineering chemistry.chemical_element Accelerometer Die (integrated circuit) Surface micromachining Acceleration chemistry Optoelectronics Electronics Electrical and Electronic Engineering Thin film business
Zdroj:	Proceedings ISSCC '95 - International Solid-State Circuits Conference.
DOI:	10.1109/isscc.1995.535504
Popis:	A surface micromachined accelerometer with on-chip electronics realized in a 3 /spl mu/m BiCMOS technology is described. The sensing element consists of a thin film of polysilicon that is deposited after fabrication of the electronic circuitry. Acceleration is measured by capacitively sensing sub-angstrom displacements of a mechanical proof-mass weighing 0.5 /spl mu/grams. The sensor uses force-feedback and achieves a resolution of 1.6 mg//spl radic/(Hz) (1 g=9.8 m/s/sup 2/). The limitations arising from the small size and mass of the sensing element and means for improvement are discussed. The small active die area of less than 3 mm/sup 2/ including the sensor along with the possibility to combine several different sensors on a single chip make this approach particularly attractive for applications demanding very small form factors.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_dedup___::123ca3298a605c8a6fb3d4677a3d95a8 https://doi.org/10.1109/isscc.1995.535504 Zobrazit plný text záznamu