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The current study is focused on understanding the role of different void removal mechanisms in VBO processing of advanced thermoplastic composites. For this purpose, two commercially available Carbon/Poly-Ether-Ketone-Ketone (C/PEKK) tape materials were evaluated, distinct in morphologies, such as surface roughness and fiber-matrix distribution, and physical characteristics, mainly the presence of volatiles. The VBO consolidation results proved that the void reduction and removal mechanisms varied depending on the tape material. However, restricting the void reduction mechanism to dissolution and diffusion alone. Depending on the tape material, a significant difference in the consolidation dwell time was observed to achieve |
