Exploring water and ion transport process at silicone/copper interfaces using in-situ electrochemical and Kelvin probe approaches
| Autor: | Johannes M. C. Mol, Annemarie Herrmann, W.D. van Driel, Balakrishnan Munirathinam, S.J.F. Erich, F. De Buyl, J.P.B. van Dam, Olaf C. G. Adan, L.G.J. van der Ven |
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| Přispěvatelé: | Transport in Permeable Media, Physical Chemistry, EIRES Systems for Sustainable Heat |
| Jazyk: | angličtina |
| Rok vydání: | 2021 |
| Předmět: |
Materials science
Absorption of water Polymers and Plastics Ion Transport Process 02 engineering and technology 010402 general chemistry 01 natural sciences chemistry.chemical_compound Silicone Materials Chemistry Microelectronics Water transport Kelvin probe force microscope business.industry Mechanical Engineering Metals and Alloys Scanning Kelvin probe Impedance 021001 nanoscience & nanotechnology 0104 chemical sciences Dielectric spectroscopy Chemical engineering chemistry Mechanics of Materials Attenuated total reflection Delamination Ceramics and Composites 0210 nano-technology business |
| Zdroj: | Journal of Materials Science and Technology, 64, 203-213. Elsevier Journal of Materials Science & Technology: an international journal in the field of materials science, 64 |
| ISSN: | 1005-0302 |
| Popis: | In general, packaging materials which encapsulate light emitting diodes (LEDs) and microelectronic devices offer barrier protection against several environmental hazards such as water and ionic contaminants. However, these encapsulants may provide pathways for water and ionic contaminants to reach the metal/polymer interfaces and provoke local corrosion of electronics, which is a major reliability concern for polymer encapsulated LEDs and microelectronics. As the water and corrosive constituents play a crucial role in their reliability, water uptake kinetics, interfacial ion transport and delamination behaviour of silicone coated copper model system, mimicking a typical microelectronics packaging system, is explored in the present work. Electrochemical impedance spectroscopy (EIS) integrated with attenuated total reflection Fourier transform infrared (ATR-FTIR) spectroscopy studies revealed that water diffusion inside the silicone network is Fickian in nature and the evolution of the observed time constants are related to the diffusion and interfacial reactions. A decrease of impedance magnitude with time was observed in EIS measurements concurrently with water absorption bands shifting towards lower wavenumber in ATR-FTIR measurements, implying the growth of strong hydrogen bonding between water molecules and the silicone network. The estimated diffusion constant of water using the capacitance method was in the order of 7 × 10-12 m2 s−1 and the water absorption volume fraction was in the range of 0% to 0.30%. Scanning Kelvin probe studies elucidated the ion transport process occurring at the silicone/copper interface in a humid atmosphere. The interfacial ion transport process is controlled by the interfacial electrochemical reactions at the cathodic delamination front and the estimated average delamination rate is 0.43 mm h-1/2. This work demonstrates that exploring ion and water transport in the silicone coating and along the silicone/copper interface is of pivotal importance as part of a detailed reliability assessment of the polymer encapsulated LEDs and microelectronics. |
| Databáze: | OpenAIRE |
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