Nanomechanical optical devices fabricated with aligned wafer bonding
| Autor: | Paul Lambeck, Johannes G.E. Gardeniers, T.M. Koster, Johan W. Berenschot, Michael Curt Elwenspoek, C. Gui, G.J. Veldhuis |
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| Přispěvatelé: | Faculty of Science and Technology, Mesoscale Chemical Systems |
| Rok vydání: | 1998 |
| Předmět: |
Materials science
Silicon business.industry Wafer bonding chemistry.chemical_element Polishing EWI-13471 IR-15873 Surface micromachining chemistry Chemical-mechanical planarization Phase (matter) METIS-112755 Hardware_INTEGRATEDCIRCUITS Optoelectronics business Intensity (heat transfer) Silicon micromachining |
| Zdroj: | The Eleventh Annual International Workshop on Micro Electro Mechanical Systems, MEMS 98 Proceedings, 482-487 STARTPAGE=482;ENDPAGE=487;TITLE=The Eleventh Annual International Workshop on Micro Electro Mechanical Systems, MEMS 98 Proceedings |
| Popis: | This paper reports on a new method for making some types of integrated optical nanomechanical devices. Intensity modulators as well as phase modulators were fabricated using several silicon micromachining techniques, including chemical mechanical polishing and aligned wafer bonding. This new method enables batch fabrication of the nanomechanical optical devices, and enhances their performance. |
| Databáze: | OpenAIRE |
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