On the test of single via related defects in digital VLSI designs
Autor: | Michelangelo Grosso, Maurizio Ricci, Nunzio Mirabella |
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Jazyk: | angličtina |
Rok vydání: | 2020 |
Předmět: |
010302 applied physics
Digital electronics Very-large-scale integration reliability business.industry Computer science 020208 electrical & electronic engineering single via Code coverage defect-oriented testing design for manufacturing test Hardware_PERFORMANCEANDRELIABILITY 02 engineering and technology 01 natural sciences Reliability engineering Design for manufacturability 0103 physical sciences Hardware_INTEGRATEDCIRCUITS 0202 electrical engineering electronic engineering information engineering Redundancy (engineering) Electronic design automation business Automated method |
Zdroj: | DDECS |
Popis: | Vias are critical for digital circuit manufacturing, as they represent a common defect location, and a general DfM rule suggests replicating every instance for redundancy. When this is not achievable, a mandatory requirement is that the remaining single vias must be tested. We propose an automated method for generating tests and accurately evaluating test coverage of such defects, ready for use in any digital implementation flow and for integration within EDA tools, and also providing a useful quality metric. A prototype tool implementation and experimental results for an industrial case study are presented. |
Databáze: | OpenAIRE |
Externí odkaz: |
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