Dynamic Pad Surface Metrology Monitoring by Swing-Arm Chromatic Confocal System
| Autor: | Chun-Chen Chen, Chao-Chang A. Chen, Jen-Chieh Li, Yong-Jie Ciou, Wei-Cheng Liao |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 2020 |
| Předmět: |
0209 industrial biotechnology
Materials science Semiconductor device fabrication Polishing 02 engineering and technology Fixture lcsh:Technology pad lifetime lcsh:Chemistry pad dressing 020901 industrial engineering & automation Chemical-mechanical planarization Surface roughness Hardware_INTEGRATEDCIRCUITS General Materials Science Wafer CMP Instrumentation lcsh:QH301-705.5 pad uniformity Groove (music) Fluid Flow and Transfer Processes Hardware_MEMORYSTRUCTURES business.industry lcsh:T Process Chemistry and Technology General Engineering dynamic measurement 021001 nanoscience & nanotechnology lcsh:QC1-999 Computer Science Applications lcsh:Biology (General) lcsh:QD1-999 Surface metrology lcsh:TA1-2040 Optoelectronics 0210 nano-technology business lcsh:Engineering (General). Civil engineering (General) lcsh:Physics |
| Zdroj: | Applied Sciences Volume 11 Issue 1 Applied Sciences, Vol 11, Iss 179, p 179 (2021) |
| ISSN: | 2076-3417 |
| DOI: | 10.3390/app11010179 |
| Popis: | This study aims to develop a dynamic pad monitoring system (DPMS) for measuring the surface topography of polishing pad. Chemical mechanical planarization/polishing (CMP) is a vital process in semiconductor manufacturing. The process is applied to assure the substrate wafer or thin film on wafer that has reached the required planarization after deposition for lithographic processing of the desired structures of devices. Surface properties of polishing pad have a huge influence on the material removal rate (MRR) and quality of wafer surface by CMP process. A DPMS has been developed to analyze the performance level of polishing pad for CMP. A chromatic confocal sensor is attached on a designed fixture arm to acquire pad topography data. By swing-arm motion with continuous data acquisition, the surface topography information of pad can be gathered dynamically. Measuring data are analyzed with a designed FFT filter to remove mechanical vibration and disturbance. Then the pad surface profile and groove depth can be calculated, which the pad&rsquo s index PU (pad uniformity) and PELI (pad effective lifetime index) are developed to evaluate the pad&rsquo s performance level. Finally, 50 rounds of CMP experiments have been executed to investigate the correlations of MRR and surface roughness of as-CMP wafer with pad performance. Results of this study can be used to monitor the pad dressing process and CMP parameter evaluation for production of IC devices. |
| Databáze: | OpenAIRE |
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