Interfacial evolution behavior of AgSbTe2.01/nanosilver/Cu thermoelectric joints
| Autor: | Tun Liu, Lianyong Xu, Huayi Li, Guo-Quan Lu, Hongyang Jing, Yongdian Han |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 2016 |
| Předmět: |
Materials science
Diffusion barrier Mechanical Engineering Metallurgy Energy conversion efficiency 02 engineering and technology 010402 general chemistry 021001 nanoscience & nanotechnology Thermoelectric materials 01 natural sciences 0104 chemical sciences Thermoelectric generator Mechanics of Materials Soldering Electrode Thermoelectric effect lcsh:TA401-492 General Materials Science lcsh:Materials of engineering and construction. Mechanics of materials Composite material 0210 nano-technology Layer (electronics) |
| Zdroj: | Materials & Design, Vol 89, Iss, Pp 604-610 (2016) |
| ISSN: | 0264-1275 |
| Popis: | For high conversion efficiency thermoelectric generators, the preparation of fine and stable junctions between thermoelectric (TE) materials and electrodes is one of the core issues. In this paper, TE material AgSbTe2.01 applied in medium temperature (200–400 °C) was successfully connected to copper electrode by low-temperature joining technique with nanosilver paste. 316 stainless steel was sputtered on the surface of TE material as the diffusion barrier layer. To investigate the interfacial evolution behavior, joints suffered from a bulk of harsh aging treatments under 200 °C to 400 °C in air environment. The results proved that 316 stainless steel could effectively block the diffusion between thermoelectric elements and element Ag in the solder at 200 °C to 400 °C. The formation of FeTe2 at AgSbTe2.01/316 stainless steel interface realized a fine metallurgical interconnection which was benefit for the improvement of joint strength. However, the mismatch of crystal structure between FeTe2 and AgSbTe2.01 might lead to defects under harsh environment. It was also concluded that the failure at Ag/Cu interface caused by the formation of CuO would be the main reason for the failure of the whole junction. Keywords: Low-temperature joining technique, Nanosilver paste, Thermoelectric material, Aging tests, Diffusion barrier |
| Databáze: | OpenAIRE |
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