The BOOM project: towards 160 Gb/s packet switching using SOI photonic integrated circuits and hybrid integrated optical flip-flops

Autor: Hercules Avramopoulos, Konstantinos Vyrsokinos, I. Lazarou, Fausto Gomez-Agis, Karsten Voigt, H.J.S. Dorren, D. Van Thourhout, Chronis Stamatiadis, Lars Zimmermann, Leontios Stampoulidis, P. De Heyn
Přispěvatelé: Electro-Optical Communication
Jazyk: angličtina
Rok vydání: 2012
Předmět:
Zdroj: JOURNAL OF LIGHTWAVE TECHNOLOGY
Journal of Lightwave Technology, 30(1), 22-30. IEEE/LEOS
ISSN: 0733-8724
Popis: We present a 160 Gb/s optical packet switching architecture that performs label detection and packet wavelength conversion using photonic components integrated on silicon-on-insulator (SOI) waveguide boards. For label detection, we report the fabrication of a 4-channel tunable, second-order microring resonator demultiplexer using the SOI nanowire waveguide platform. For all-optical wavelength conversion we report the integration and packaging of a cascaded SOI delay interferometer (DI) structure using SOI rib waveguides. Both components were assembled with an optical flip-flop to enable 160 Gb/s optical packet switching. The power penalty after the wavelength conversion process was ~4.5 dB with error performance well above the FEC limit. This work is part of the European ICT-BOOM project which aims at building a Tb/s photonic router using hybrid and heterogeneous integration on SOI substrates. The preliminary results reported here is the initial step before the final project demonstrator. Index Terms—All-optical signal processing, all-optical wavelength converter (AOWC), all-optical wavelength routing, hybrid photonic integration, microring resonator, optical flip-flop, optical packet switching, silicon-on-insulator (SOI).
Databáze: OpenAIRE