Influence of the Anode on the Degradation of the Additives in the Damascene Process for Copper Deposition
| Autor: | Alan D. Zdunek, D. Nieto-Sanz, Hubert Perrot, P. Mocoteguy, Claude Gabrielli |
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| Přispěvatelé: | Laboratoire Interfaces et Systèmes Electrochimiques (LISE), Université Pierre et Marie Curie - Paris 6 (UPMC)-Centre National de la Recherche Scientifique (CNRS), AIR LIQUIDE, * Chicago Research Center, Countryside, Illinois 60525, USA, Air Liquide, Centre de Recherche Claude-Delorme, Paris-Saclay, France. |
| Rok vydání: | 2007 |
| Předmět: |
Materials science
Renewable Energy Sustainability and the Environment Metallurgy Copper interconnect chemistry.chemical_element Glassy carbon Condensed Matter Physics Copper Surfaces Coatings and Films Electronic Optical and Magnetic Materials Anode chemistry Plating Materials Chemistry Electrochemistry Copper plating [CHIM]Chemical Sciences Degradation (geology) Voltammetry |
| Zdroj: | Journal of The Electrochemical Society Journal of The Electrochemical Society, 2007, 154 (3), pp.D163. ⟨10.1149/1.2426897⟩ |
| ISSN: | 0013-4651 1945-7111 |
| DOI: | 10.1149/1.2426897 |
| Popis: | The influence of both soluble and insoluble anodes on the kinetics and morphology of the copper deposit in the damascene process was investigated by voltammetry and impedance techniques. A plating bath known to provide conformal superfilling of trenches and vias in the microelectronic industry was used. It was shown that the use of a glassy carbon anode leads to faster degradation of the plating bath which is detrimental to the copper deposit. A copper anode decreases the aging rate by limiting the anodic potential compared to the glassy carbon anode where high anodic potentials prevail during the copper deposition process. |
| Databáze: | OpenAIRE |
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